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INTERNATIONAL PATENT: KYB CORPORATION, カヤバ株式会社 FILES APPLICATION FOR "ELECTRICAL PUMP AND ELECTRICAL PUMP UNIT"

GENEVA, March 9 -- KYB CORPORATION (4-1, Hamamatsu-cho 2-chome, Minato-ku, Tokyo1055128), カヤバ株式会社 (東京都港区浜&#26... Read More


INTERNATIONAL PATENT: TOPPAN HOLDINGS INC., TOPPANホールディングス株式会社 FILES APPLICATION FOR "CHANNEL STRUCTURE, MICROCHANNEL DEVICE AND WEARABLE DEVICE"

GENEVA, March 9 -- TOPPAN HOLDINGS INC. (5-1, Taito 1-chome, Taito-ku, Tokyo1100016), TOPPANホールディングス&#... Read More


INTERNATIONAL PATENT: NITTO DENKO CORPORATION, 日東電工株式会社 FILES APPLICATION FOR "HOLLOW FIBER-LIKE POROUS BODY, HOLLOW FIBER MEMBRANE AND METHOD FOR MANUFACTURING HOLLOW FIBER-LIKE POROUS BODY"

GENEVA, March 9 -- NITTO DENKO CORPORATION (1-2, Shimohozumi 1-chome, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨&#26... Read More


INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックIPマネジメント株式会社 FILES APPLICATION FOR "SENSOR AND DISASTER PREVENTION SYSTEM"

GENEVA, March 9 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックIPマネ&#... Read More


INTERNATIONAL PATENT: DAIKIN INDUSTRIES, LTD., ダイキン工業株式会社 FILES APPLICATION FOR "COMPOSITION FOR HEAT TRANSFER FLUID, HEAT TRANSFER FLUID, HEAT TRANSFER DEVICE AND HEAT TRANSFER METHOD"

GENEVA, March 9 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-Shi, Osaka5300001), ダイキン工業株式会&#3... Read More


INTERNATIONAL PATENT: NEC CORPORATION, 日本電気株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND RECORDING MEDIUM"

GENEVA, March 9 -- NEC CORPORATION (7-1, Shiba 5-chome, Minato-ku, Tokyo1088001), 日本電気株式会社 (東京都港区芝&#20... Read More


INTERNATIONAL PATENT: MITSUBISHI HEAVY INDUSTRIES, LTD., 三菱重工業株式会社, MITSUBISHI POWER, LTD., 三菱パワー株式会社 FILES APPLICATION FOR "BOILER SYSTEM, POWER GENERATION PLANT AND BOILER SYSTEM OPERATION METHOD"

GENEVA, March 9 -- MITSUBISHI HEAVY INDUSTRIES, LTD. (2-3, Marunouchi 3-Chome, Chiyoda-ku, Tokyo1008332), 三菱重工業株式会社 (東京&#37... Read More


INTERNATIONAL PATENT: POLYPLASTICS CO., LTD., ポリプラスチックス株式会社 FILES APPLICATION FOR "POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDED ARTICLE"

GENEVA, March 9 -- POLYPLASTICS CO., LTD. (2-18-1, Konan, Minato-ku, Tokyo1088280), ポリプラスチックス株式会社 (東&#... Read More


INTERNATIONAL PATENT: OOKUMA DIAMOND DEVICE CO., LTD., 大熊ダイヤモンドデバイス株式会社 FILES APPLICATION FOR "SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, DIAMOND WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE"

GENEVA, March 9 -- OOKUMA DIAMOND DEVICE CO., LTD. (Hokudai Business Spring, 2, Kita 21-jyo Nishi 12-chome, Kita-ku, Sapporo-shi, Hokkaido0010021), 大熊ダイヤモ&#12... Read More


INTERNATIONAL PATENT: FUJIKURA LTD., 株式会社フジクラ FILES APPLICATION FOR "OUTPUT MATCHING CIRCUIT"

GENEVA, March 9 -- FUJIKURA LTD. (1-5-1, Kiba, Koto-ku, Tokyo1358512), 株式会社フジクラ (東京都江東区木&#22580... Read More